WHAT IS A to-220 package?

WHAT IS A to-220 package?

The TO-220 is a style of electronic package used for high-powered, through-hole components with 0.1 inches (2.54 mm) pin spacing. The “TO” designation stands for “transistor outline”. TO-220 packages have three leads. Similar packages with two, four, five or seven leads are also manufactured.

What is the purpose of the metal tab at the top of the to-220 package?

TO-220 Package. Case mount. [or Tab Mount] Is a style of package which provides a method of readily attaching one surface [the tab] of the semiconductor device to a [heat sink] to achieve thermal management of the case temperature.

What is transistor outline package?

In electronics, TO-3 is a designation for a standardized metal semiconductor package used for power semiconductors, including transistors, silicon controlled rectifiers, and, integrated circuits. TO stands for “Transistor Outline” and relates to a series of technical drawings produced by JEDEC.

What are to packages?

TO packages consist of a TO header and a TO cap. While the TO header forms the basis of the encapsulated components and provides them with power, the cap enables smooth optical signal transmission. These two components form a hermetically sealed package that protects sensitive semiconductor components.

What are different types of IC packaging?

The Common IC Packaging Types

• DIP (Double In-line Package)
• SOP/SOIC/SO (Small Outline Package)
• QFP (Quad Flat Package)
• QFN/LCC (Quad Flat Non-leaded Package)
• BGA (Ball Grid Array Package)
• CSP (Chip Scale Package)

What are the 5 types of packaging?

Here are five of the most common types of packing materials that can accommodate a wide variety of company needs.

• Crates and Pallets.
• Shrink Wrap.
• Vacuum Packaging.
• Preservation Packaging.
• Shock Mount Packaging.

What is pitch of IC?

The pad pitch on the IC chip is typically 0.006 inch (6 mils or 152µm). This spacing is already much larger than the 2 to 8 microns (0.08 to 0.31 mils) pitch of the wiring (metallization) on the IC chip. But PCB wiring requires an even larger pitch, usually between 40 and 100 mils.

What is package of IC?

IC packaging refers to the material that contains a semiconductor device. The package is a case that surrounds the circuit material to protect it from corrosion or physical damage and allow mounting of the electrical contacts connecting it to the printed circuit board (PCB).

What are the 3 levels of packaging?

The following is a brief overview of all three types of packaging, which together typically form a complete packaging line.

• PRIMARY PACKAGING. Primary packaging is the packaging in direct contact with the product itself and is sometimes referred to as a consumer unit.
• SECONDARY PACKAGING.
• TERTIARY PACKAGING.

What are the 4 methods of packaging?

Different Types of Packaging Methods: Explained

• Paperboard Boxes. Paperboard boxes are one of the most common types of packaging.
• Bottle & Jars. Bottles and jars are another popular packaging method.
• Shrink Wrap.
• Hinged Containers.
• Plastic Containers.
• Clamshell Packaging.
• Foil-Sealed Bags.
• Chipboard Packaging Boxes.

What is IC and its types?

There are two types of IC manufacturing technologies one is monolithic technology and other is hybrid technology. In monolithic technique, all electronic component and their interconnections are manufactured together into a single chip of silicon.